High Purity Industrial Synthetic Homothetic Polycrystalline Diamond Powder

• Customization: Available
• Material: Diamond
• Usage: Polishing, Grind
• Model NO.: HPDP
• Customized: Customized
• Color: Black
• Shipping Method: FedEx, DHL, UPS, TNT etc.
• OEM: Available
• Particle Size: 0.05- 60um
• Purity: >99%
• Other Ports: Tianjin, Shanghai, Qingdao, Guangzhou etc.
• Transport Package: Bag, Bottle or Customized Packing
• Specification: 500cts/bag, 1000cts/bag
• Trademark: Treeing, Neutral or OEM
• Origin: China
• HS Code: 71051020
• Production Capacity: 50000000000 Cts/Year

Product Description

Homothetic Polycrystalline Diamond Powder (HPDP)

Treeing provides a comprehensive array of synthetic diamond powder in the micron and sub-micron size range.
Industrial diamond powder has the characteristics of high thermal stability, high chemical stability, good conductivity, good physical properties (high compressive strength, good heat dissipation, strong corrosion resistance, low thermal expansion rate) and so on. It has high hardness and good wear resistance, and can be widely used for cutting, grinding and drilling. Diamond abrasive powder has high thermal conductivity and good electrical insulation, which can be used as a heat sink for semiconductor devices. Besides, diamond powder abrasive has excellent light transmission and corrosion resistance, and is widely used in the electronics industry.
Micron diamond powders are widely used for the superfinishing of hard materials with demanding specifications for surface quality and dimensional accuracy. For effective use this powder should be mixed into a polishing compound or slurry with some type of a carrier.


The unique surface characteristics of Treeing HPDP deliver remarkable material removal rate with the added benefit of an excellent surface finish. The HPDP comes in the form of powder or slurry and is ideally suitable for LED and semiconductor materials (i.e. sapphire, SiC, silicon), metallographic applications and fine finishing. Due to the distinctive micro-faceted diamond surface that provides small cutting points to drastically reduce the surface roughness of the workpiece.
 

Specification	D10(μm)	D50(μm)	D90(μm)
2-4	≥1.90	2.7-2.9	≤4.26
2-5	≥2.22	3.1-3.3	≤4.62
3-5	≥2.55	3.6-3.9	≤5.46
3-6	≥2.92	3.9-4.3	≤6.02
4-6	≥3.36	4.5-5.0	≤6.90
4-8	≥4.35	5.8-6.1	≤8.54
5-9	≥4.57	6.1-6.4	≤8.96
5-10	≥4.97	6.5-7.4	≤10.35
8-12	≥6.75	9.0-10.5	≤14.60
12-22	≥11.35	15-17	≤23.30
15-25	≥13.30	17.5-19.3	≤26.52
20-30	≥15.20	20-23	≤31.70
25-35	≥17.45	23-26	≤36.00
30-40	≥24.25	32-36	≤49.90

Work Materials
 

• Ceramica
• ZnSe Wafer
• Sapphire
• SiC Wafer
• Metallography
• Watch Dial
• Metal Mold
• Gem Stone 
• Titanium Alloy Joint
• Stone & Glass
• CBN superhard tools

Applications

• Cutting
• Grinding
• Lapping
• Finishing
• Polishing